Second-hand Wafer Double-Side Polishing Machine / Silicon Wafer Double-Side Lapping Machine / High-Precision Lapping Machine

Factory Transfer Imported C/M/T CGD-16B Double-Sided Polishing Machine/Grinder
Sales Technical Manager Yang: 18103045976
Main Specifications of the Equipment
3-phase 220V, 50Hz
Equipment Dimensions 1800L x 1550W x 2850H (excluding electrical/air box)
Control Touch screen and PLC control
Air Pressure 3-6 kg/cm² Max.
Plate Size POL fZ84xF1140x55t [SUS410]
Robot Empty Tray R.P.M Max 46 R.P.M (inverter drive)
Motor 7.5Kw x 4P
Worm gear (reduction ratio 1/25) box transmission
Top Tray R.P.M Max 20 RPM (inverter drive)
Motor 3.7Kw x 4P
Worm gear (reduction ratio 1/60) box transmission
Top Air Cylinder ø180x550L (low friction cylinder)
Work Size Setting Solar Flat unit control (LAPPING)
Carrier Parts Carrier Size RSD.F42ZZ4Dr=12/Z=2007
Insert Quantity 5EA
Work Size
Internal Gear R.S.D.F.1185.Z4 [Dr=12/Z=560]
R.P.M 23 drops Max. R.P.M (servo motor
Motor HC-SFS352 [3.5Kw]
Method Reduction ratio 1/14) planetary gear reduction drive (rise fall 35

Sun Gear R.S.D.FZ.8.67 [Dr=12/Z=160]
R.P.M 29 degrees Max R.P.M (servo motor
Motor HC-SFS152 [1.5Kw]
Planetary gear control drive (reduction ratio 1/60
Rise Fall Manual operation 20